毕业设计英文翻译资料
题目：超声波测距仪的设计与制作
院（系）：
专业：计算机通信工程
学生姓名：张社强
班级：
学号：
指导教师：刘争红
年月日
Integrated circuit
In electronics, an integrated circuit (also known as IC, microcircuit, microchip, silicon chip, or chip) is a miniaturized electronic circuit (consisting mainly of semiconductor devices, as well as passive components) that has been manufactured in the surface of a thin substrate of semiconductor material. Integrated circuits are used in almost all electronic equipment in use today and have revolutionized the world of electronics.
Integrated circuits were made possible by experimental discoveries which showed that semiconductor devices could perform the functions of vacuum tubes, and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors.
There are two main advantages of ICs over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography and not constructed one transistor at a time. Furthermore, much less material is used to construct a circuit as a packaged IC die than as a discrete circuit. Performance is high since the components switch quickly and consume little power (compared to their discrete counterparts) because the components are small and close together. As of 2006, chip areas range from a few square millimeters to around 350 mm2, with up to 1 million transistors per mm2.
Among the most advanced integrated circuits are the microprocessors or "cores", which control everything from computers to cellular phones to digital microwave ovens. Digital memory chips and ASICs are examples of other families of integrated circuits that are important to the modern information society. While the cost of designing and developing a complex integrated circuit is quite high, when spread across typically millions of production units the individual IC cost is minimized. The performance of ICs is high because the small size allows short traces which in turn allows low power logic (such as CMOS) to be used at fast switching speeds.
ICs have consistently migrated to smaller feature sizes over the years, allowing more circuitry to be packed on each chip. This increased capacity per unit area can be used to decrease cost and/or increase functionality—see Moore's law which, in its modern interpretation, states that the number of transistors in an integrated circuit doubles every two years. In general, as the
feature size shrinks, almost everything improves—the cost per unit and the switching power consumption go down, and the speed goes up. However, ICs with nanometer-scale devices are not without their problems, principal among which is leakage current (see subthreshold leakage for a discussion of this), although these problems are not insurmountable and will likely be solved or at least ameliorated by the introduction of high-k dielectrics. Since these speed and power consumption gains are apparent to the end user, there is fierce competition among the manufacturers to use finer geometries. This process, and the expected progress over the next few years, is well described by the International Technology Roadmap for Semiconductors (ITRS).
Only a half century after their development was initiated, integrated circuits have become ubiquitous. Computers, cellular phones, and other digital appliances are now inextricable parts of the structure of modern societies. That is, modern computing, communications, manufacturing and transport systems, including the Internet, all depend on the existence of integrated circuits.
Integrated circuits can be classified into analog, digital and mixed signal (both analog and digital on the same chip).
Digital integrated circuits can contain anything from one to millions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation,
and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors, DSPs, and micro controllers work using binary mathematics to process "one" and "zero" signals.
Analog ICs, such as sensors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, mixing, etc. ICs can also combine analog and digital circuits on a single chip to create functions such as A/D converters and D/A converters. Such circuits offer smaller size and lower cost, but must carefully account for signal interference.
The semiconductors of the periodic table of the chemical elements were identified as the most likely materials for a solid state vacuum tube by researchers like William Shockley at Bell Laboratories starting in the 1930s. Starting with copper oxide, proceeding to germanium, then silicon, the materials were systematically studied in the 1940s and 1950s. Today, silicon monocrystals are the main substrate used for integrated circuits (ICs) although some III-V compounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs, lasers, solar cells and the highest-speed integrated circuits. It took decades to perfect methods of creating crystals without defects in the crystalline structure of the
semiconducting material.
Semiconductor ICs are fabricated in a layer process which includes these key process steps: Imaging
Deposition
Etching
The main process steps are supplemented by doping and cleaning.
Integrated circuits are composed of many overlapping layers, each defined by photolithography, and normally shown in different colors. Some layers mark where various dopants are diffused into the substrate (called diffusion layers), some define where additional ions are implanted (implant layers), some define the conductors (polysilicon or metal layers), and some define the connections between the conducting layers (via or contact layers). All components are constructed from a specific combination of these layers.
In a self-aligned CMOS process, a transistor is formed wherever the gate layer (polysilicon or metal) crosses a diffusion layer.
Since a CMOS device only draws current on the transition between logic states, CMOS devices consume much less current than bipolar devices.
A random access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even a microprocessor will have memory on the chip. Although the structures are intricate – with widths which have been shrinking for decades –the layers remain much thinner than the device widths. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to "expose" a layer of material, as they would be too large for the features. Thus photons of higher frequencies (typically ultraviolet) are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process.
The earliest integrated circuits were packaged in ceramic flat packs, which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by small-outline integrated circuit -- a carrier which occupies an area about 30 – 50% less than an equivalent DIP, with a typical thickness that is 70% less. This package has "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches.
In the late 1990s, PQFP and TSOP packages became the most common for high pin count devices, though PGA packages are still often used for high-end microprocessors. Intel and AMD are currently transitioning from PGA packages on high-end microprocessors to land grid array (LGA) packages.
Ball grid array (BGA) packages have existed since the 1970s. Flip-chip Ball Grid Array packages, which allow for much higher pin count than other package types, were developed in the 1990s.
Most integrated circuits large enough to include identifying information include four common sections: the manufacturer's name or logo, the part number, a part production batch number and/or serial number, and a four-digit code that identifies when the chip was manufactured. Extremely small surface mount technology parts often bear only a number used in a manufacturer's lookup table to find the chip characteristics.
The manufacturing date is commonly represented as a two-digit year followed by a two-digit week code, such that a part bearing the code 8341 was manufactured in week 41 of 1983, or approximately in October 1983.
Structure and function of the MCS-51 series
Structure and function of the MCS-51 series one-chip computer is a name of a piece of one-chip computer series which Intel Company produces. This company introduced 8 top-grade one-chip computers of MCS-51 series in 1980 after introducing 8 one-chip computers of MCS-48 series in 1976. It belong to a lot of kinds this line of one-chip computer the chips have,such as 8051, 8031, 8751, 80C51BH, 80C31BH,etc., their basic composition, basic performance and instruction system are all the same. 8051 daily representatives- 51 serial one-chip computers .
An one-chip computer system is made up of several following parts: ( 1) One microprocessor of 8 (CPU). ( 2) At slice data memory RAM (128B/256B),it use not depositting not can reading /data that write, such as result not middle of operation, final result and data wanted to show, etc. ( 3) Procedure memory ROM/EPROM (4KB/8KB ), is used to preserve the procedure , some initial data and form in slice. But does not take ROM/EPROM within some one-chip computers, such as 8031 , 8032, 80C ,etc.. ( 4) Four 8 run side by side I/O interface P0 four P3, each mouth can use as introduction , may use as exporting too. ( 5) Two timer / counter, each timer / counter may set up and count in the way, used to count to the external incident, can set up into a timing way too, and can according to count or result of timing realize the control of the computer. ( 6) Five cut off cutting off the control system of the source . ( 7) One all duplexing serial I/O mouth of UART (universal asynchronous receiver/transmitter (UART) ), is it realize one-chip computer or one-chip computer and serial
communication of computer to use for. ( 8) Stretch oscillator and clock produce circuit, quartz crystal finely tune electric capacity need outer. Allow oscillation frequency as 12 megahertas now at most. Every the above-mentioned part was joined through the inside data bus .Among them, CPU is a core of the one-chip computer, it is the control of the computer and command centre, made up of such parts as arithmetic unit and controller , etc.. The arithmetic unit can carry on 8 persons of arithmetic operation and unit ALU of logic operation while including one, the 1 storing device temporarilies of 8, storing device 2 temporarily, 8's accumulation device ACC, register B and procedure state register PSW, etc. Person who accumulate ACC count by 2 input ends entered of checking etc. temporarily as one operation often, come from person who store 1 operation is it is it make operation to go on to count temporarily , operation result and loopback ACC with another one. In addition, ACC is often regarded as the transfer station of data transmission on 8051 inside . The same as general microprocessor, it is the busiest register. Help remembering that agreeing with A expresses in the order. The controller includes the procedure counter , the order is depositted, the order decipher, the oscillator and timing circuit, etc. The procedure counter is made up of counter of 8 for two, amounts to 16. It is a byte address counter of the procedure in fact, the content is the next IA that will carried out in PC. The content which changes it can change the direction that the procedure carries out . Shake the circuit in 8051 one-chip computers, only need outer quartz crystal and frequency to finely tune the electric capacity, its frequency range is its 12MHZ of 1.2MHZ. This pulse signal, as 8051 basic beats of working, namely the minimum unit of time. 8051 is the same as other computers, the work in harmony under the control of the basic beat, just like an orchestra according to the beat play that is commanded.
译文：
集成电路
在电子学中，集成电路（亦称为ＩＣ，微型电路，微型芯片等），是一种制造于半导体材料薄膜衬底表面的小型化电路（主要包括半导体设备和无源器件）。集成电路普遍应用于当今的电子设备中，彻底改变了电子世界。
实验表明半导体器件可以实现真空管的功能。20世纪中期半导体制造技术的进步，使得集成电路成为可能。相对于手工组装电路使用分立的电子元器件，集成电路把大量的微晶体管集成到一个小芯片，是一个巨大的进步。集成电路的大规模生产性，可靠性和模块化，使得应用标准化IC的电路设计迅速取代了使用离散晶体管的电路设计。
集成电路相对于离散晶体管有两个主要的优势：成本和性能。成本低是由于芯片把所有的元件通过照相平版技术，作为一个单位印刷，而不是在一个时间只制作一个晶体管。此外，实现同样的功能，集成电路使用的电子材料比分立式的要少得多。性能高是由于元件快速开关，消耗更低能量（相对于分立式元器件），因为元件很小且彼此靠得很近。2006年，芯片面积从几平方毫米到约350 mm2，每mm2可以集成达到一百万个晶体管。
最先进的集成电路是微处理器或称核,它用于控制大到电脑小到手机或数字微波炉等。数字存储芯片和ASIC是其它系列集成电路家族的例子，它们对于现代信息社会非常重要。虽然单独设计开发一个复杂的集成电路的成本非常高，但当分散到数以百万计的产品上，每个IC的成本就很小了。IC的性能很高，因为微小元件带来很短的线路，使得低功率逻辑电路（如CMOS电路）可以应用于高速开关。
近些年来，IC的尺寸不断微型化，使得单个芯片可以封装更多的电路。这样可以增加每单位面积上元器件得的数量，降低了成本和增加了功能。由摩尔定律的现代释义可知，集成电路中的晶体管数量，每两年增加一倍。总之，随着外形尺寸缩小，几乎所有的性能指标都得到了改善——单位成本和开关功耗下降了，运行速度提高了。但是，纳米级的IC并非没有问题，其中最主要的问题是泄漏电流（参见亚阈值泄漏）。虽然这个问题不能完全克服，但至少可以通过引入高阻抗的电导来改善其性能。由于用户对IC 的运行速度和功率消耗非常敏感，各生产商在如何开发运用更好的技术上存在着激烈的竞争。这个过程以及在未来几年可能取得的进步，在国际半导体技术蓝图（ITRS）中有很好的描述。
仅在其发明后的半个世纪，集成电路变得无处不在。电脑，手机和其他数码产品成为现代社会不可缺少的一部分。现代计算，通信，制造和交通系统，包括互联网，全都依赖于集成电路的存在。
IC可分为模拟IC，数字IC和数模混合IC（同一块IC上既有模拟电路也有数字电路）。
数字IC在几平方毫米上可以集成上百万个逻辑门，多谐振荡器，多路复用器和其它电路。微型化的电路使得IC较板级电路运行速度更快，耗能更小，生产成本更低。这些数字IC, 以微处理器，数字信号处理器（DSP）和微控制器为代表，工作中使用二进制，处理1和0信号。模拟IC，例如传感器，电源控制电路和运放，用于处理连续的模拟信号，可以完成放大，滤波，解调，混频等功能。
IC中也可以集成模拟电路和数字电路，实现如数/模转换(D/A)或模/数转换(A/D)的功能。这种电路的尺寸更小，成本更低，但必须注意信号干扰。
19世纪30年代始，研究者如贝尔实验室的William Shockley通过研究，认为在化学元素周期表中的半导体硅元素是构成固态真空管最可能的原料。从氧化铜到锗，再到硅，原料在19世纪40年代到50年代被系统的研究。今天，尽管元素周期表中的一些III-V价化合物如砷化镓有特殊用途，如应用于发光二极管，激光，太阳能电池和超高速集成电路，但单晶硅仍是集成电路的主流基层。人们花了数十年的时间来完善在半导体材料的晶体结构中创造无缺陷晶体的方法。
半导体IC是逐层制造的，其构造工艺过程包括以下关键步骤：成像，沉积，蚀刻，在其构造过程辅以掺杂及清洁。
IC 由很多重叠的层组成，每层由影像技术定义，通常用不同的颜色表示。有些层标记出不同的掺杂剂在基板上的分布（称为扩散层），有些层定义哪里有额外的离子注入（称为灌输层），有些层定义导体的特性（多晶硅层或金属层），有些层定义传导层之间的连接（过孔层或连接层）。所有的IC元件皆由这些层的特定组合构成。
在制造一个自排列CMOS的过程中，门层（多晶硅或金属）穿过扩散层形成晶体管。因为CMOS器件只引导电流在逻辑门之间转换，因而CMOS器件比双级元件消耗的电流少很多。随机存取存储器（random access memory）是最常见的集成电路，所以密度最高的设备是存储器，即使是微处理器上也有集成存储器。尽管存储器结构非常复杂——几十年来，芯片的宽度一直在减少，但芯片的层依然比其宽度薄得多。其层的制作过程非常象照相过程，虽然可见光谱中的光波不能用来曝光元件层，因为他们太大了。因而采用高频光子（通常是紫外线）来创造层的图案。因为每个特征都非常小，所以对于一个正在调试制造过程的过程工程师来说，电子显微镜是必要的工具。
最早的集成电路使用陶瓷扁平封装，这种封装由于其可靠性高和尺寸小，军方多年来一直使用。商用电路封装很快就发展到双列直插式封裝（dual in-line package DIP）,开始是陶瓷，之后是塑料。20世纪80年代，VLSI电路的针脚超过了DIP封装的应用限制，导致插针网格阵列和leadless chip carrier（LCC）的出现。贴片式的封装在20世纪80年代初期出现，在80年代后期开始流行。贴片式使用更小的脚间距，引脚形状为海鸥翼型或J型。以Small-Outline Integrated Circuit（SOIC）为例，贴片式占用面积比DIP少30－50％，厚度少70％。这种封装在两个长边有海鸥翼型引脚突出，引脚间距为0.05英寸。
90年代后期，PQFP和TSOP封装成为高引脚数器件最普遍的封装形式，尽管PGA封装仍常用于高端微处理器。英特尔和AMD目前正把高端微处理器从PGA封装过渡到（LGA）封装。
球栅阵列（BGA）封装出现于20世纪70年代。倒装芯片球栅阵列封装（FCBGA）始发展于20世纪90年代，这种封装形式允许更高的引脚数。
大多数集成电路都足够大以包含识别信息，一般包括四个部分：制造商的名称或标志，零件编号，生产批号和/或序列号以及标识芯片制造日期的4位数字代码。面积极小的贴片式封装芯片往往需要用该芯片上的一个数字到生产商的列表中查找该芯片的特点。
芯片制造日期通常表示为两位数的年份加两位数字的星期代码。例如，芯片上的代码8341表示该芯片生产于1983年的第41周，或着说大约在1983年10月生产。
51系列单片机的功能和结构：
MCS - 51系列单片机具有一个单芯片电脑的结构和功能，它是英特尔公司生产的系列产品的名称。这家公司在1976年推出8位的MCS - 48系列单芯片计算机后，于1980年推出的8位的MCS - 51系列单芯片计算机。诸如此类的单芯片电脑有很多种，如8051，8031，8751，80C51BH，80C31BH等，其基本组成，基本性能和指令系统都是相同的。 8051是51系列单芯片电脑的代表。
一个单芯片的计算机系统由以下几个部分组成：（1）一个8位的微处理器（CPU）。（2）片内数据存储器RAM（128B/256B），它只读/写数据，如结果不在操作过程中，最终结果要显示数据（3）程序存储器ROM/ EPROM（4KB/8KB），是用来保存程序，一些初步的数据和切片的形式。但一些单芯片电脑没有考虑ROM / EPROM，如8031，8032，80C51等等。（4）4个8路运行的I / O接口，P0，P1,P2,P3，每口可以用作入口，也可以用作出口。（5）两个定时/计数器，每个定时/计数器可设置和计数的方式，用来计数外部事件，可以设置成定时方式也可以根据计算结果或定时控制实现计算机。（6）5个中断（7）一个全双工串行的I / UART（通用异步接收器I口/发送器（UART）），它是实现单芯片电脑或单芯片计算机和计算机的串行通信使用。（8）振荡器和时钟产生电路，需要考虑石英晶体微调能力。允许振荡频率为12MHz，每一个上述的部分都是通过内部数据总线连接。其中CPU是一个芯片计算机的核心，它是计算机的指挥中心，是由算术单元和控制器等部分组成。算术单元可以进行8位算术运算和逻辑运算， ALU单元是其中一种运算器，1 8个存储设备，暂存设备的积累设备进行协调，程序状态寄存器PSW积累了2个输入端的计数等检查暂时作为一个操作往往由人来操作谁储存1输入的是它使操作去上暂时计数，另有一个操作的结果，回环协调。此外，协调往往是作为对8051内的数据传输转运站考虑。作为一般的微处理器，它是最繁忙的，帮助记住和同意与其的顺序表示。该控制器包括程序计数器，解密的顺序。振荡器和定时电路等的程序计数器是一个由8个计数器为2，总计 16位。这是一个字节的地址，其实程序计数器，
是在个人电脑内进行。从而改变它的内容也可以改变程序的进行方向。在8051的单芯片电脑的电路中，只需要外部石英晶体和频率微调电容，其频率范围为1.2MHz到12MHz。这种脉冲信号，作为8051的工作的单位时间的最低基本节奏。 8051是跟其他电脑一样，在节拍控制的控制下完成本工作，就像一个管弦乐队，根据节拍的指挥来演奏。
AT89C51的概况 The General Situation of AT89C51 Chapter 1 The application of AT89C51 Microcontrollers are used in a multitude of commercial applications such as modems, motor-control systems, air conditioner control systems, automotive engine and among others. The domains also require that these microcontrollers are be ensured by a robust testing process and a proper tools environment for the validation of these microcontrollers both at the component and at the system level. Intel Plaform Engineering department developed an object-oriented multi-threaded test environment for the validation of its AT89C51 automotive microcontrollers. The goals of thisenvironment was not only to provide a robust testing environment for the AT89C51 automotive microcontrollers, but to develop an environment which can be easily extended and reused for the validation of several other future microcontrollers. The environment was developed in conjunction with Microsoft Foundation Classes (AT89C51). The paper describes the design and mechanism of this test environment, its interactions with various The 8-bit AT89C51 CHMOS microcontrollers are designed to engine-control systems, airbags, suspension systems, and antilock braking systems (ABS). The AT89C51 is especially well suited to applications that benefit from its processing speed and enhanced
外文翻译 专业机械设计制造及其自动化学生姓名刘链柱 班级机制111 学号1110101102 指导教师葛友华
外文资料名称： Design and performance evaluation of vacuum cleaners using cyclone technology 外文资料出处：Korean J. Chem. Eng., 23(6), (用外文写) 925-930 (2006) 附件： 1.外文资料翻译译文 2.外文原文
应用旋风技术真空吸尘器的设计和性能介绍 吉尔泰金，洪城铱昌，宰瑾李， 刘链柱译 摘要：旋风型分离器技术用于真空吸尘器 - 轴向进流旋风和切向进气道流旋风有效地收集粉尘和降低压力降已被实验研究。优化设计等因素作为集尘效率，压降，并切成尺寸被粒度对应于分级收集的50％的效率进行了研究。颗粒切成大小降低入口面积，体直径，减小涡取景器直径的旋风。切向入口的双流量气旋具有良好的性能考虑的350毫米汞柱的低压降和为1.5μm的质量中位直径在1米3的流量的截止尺寸。一使用切向入口的双流量旋风吸尘器示出了势是一种有效的方法，用于收集在家庭中产生的粉尘。 摘要及关键词：吸尘器; 粉尘; 旋风分离器 引言 我们这个时代的很大一部分都花在了房子，工作场所，或其他建筑，因此，室内空间应该是既舒适情绪和卫生。但室内空气中含有超过室外空气因气密性的二次污染物，毒物，食品气味。这是通过使用产生在建筑中的新材料和设备。真空吸尘器为代表的家电去除有害物质从地板到地毯所用的商用真空吸尘器房子由纸过滤，预过滤器和排气过滤器通过洁净的空气排放到大气中。虽然真空吸尘器是方便在使用中，吸入压力下降说唱空转成比例地清洗的时间，以及纸过滤器也应定期更换，由于压力下降，气味和细菌通过纸过滤器内的残留粉尘。 图1示出了大气气溶胶的粒度分布通常是双峰形，在粗颗粒（>2.0微米）模式为主要的外部来源，如风吹尘，海盐喷雾，火山，从工厂直接排放和车辆废气排放，以及那些在细颗粒模式包括燃烧或光化学反应。表1显示模式，典型的大气航空的直径和质量浓度溶胶被许多研究者测量。精细模式在0.18?0.36 在5.7到25微米尺寸范围微米尺寸范围。质量浓度为2?205微克，可直接在大气气溶胶和 3.85至36.3μg/m3柴油气溶胶。
故障概率模型的数控车床 摘要：领域的失效分析被计算机数字化控制 毕业设计（论文）外文文献翻译 文献、资料中文题目：软件开发概念和设计方法文献、资料英文题目： 文献、资料来源： 文献、资料发表（出版）日期： 院（部）： 专业： 班级： 姓名： 学号： 指导教师： 翻译日期： 2017.02.14 外文资料原文 Software Development Concepts and Design Methodologies During the 1960s, ma inframes and higher level programming languages were applied to man y problems including human resource s yste ms,reservation s yste ms, and manufacturing s yste ms. Computers and software were seen as the cure all for man y bu siness issues were some times applied blindly. S yste ms sometimes failed to solve the problem for which the y were designed for man y reasons including: ?Inability to sufficiently understand complex problems ?Not sufficiently taking into account end-u ser needs, the organizational environ ment, and performance tradeoffs ?Inability to accurately estimate development time and operational costs ?Lack of framework for consistent and regular customer communications At this time, the concept of structured programming, top-down design, stepwise refinement，and modularity e merged. Structured programming is still the most dominant approach to software engineering and is still evo lving. These failures led to the concept of "software engineering" based upon the idea that an engineering-like discipl ine could be applied to software design and develop ment. Software design is a process where the software designer applies techniques and principles to produce a conceptual model that de scribes and defines a solution to a problem. In the beginning, this des ign process has not been well structured and the model does not alwa ys accurately represent the problem of software development. However,design methodologies have been evolving to accommo date changes in technolog y coupled with our increased understanding of development processes. Whereas early desig n methods addressed specific aspects of the 使用高级分析法的钢框架创新设计 1．导言 在美国，钢结构设计方法包括允许应力设计法(ASD)，塑性设计法(PD)和荷载阻力系数设计法(LRFD)。在允许应力设计中，应力计算基于一阶弹性分析，而几何非线性影响则隐含在细部设计方程中。在塑性设计中，结构分析中使用的是一阶塑性铰分析。塑性设计使整个结构体系的弹性力重新分配。尽管几何非线性和逐步高产效应并不在塑性设计之中，但它们近似细部设计方程。在荷载和阻力系数设计中，含放大系数的一阶弹性分析或单纯的二阶弹性分析被用于几何非线性分析，而梁柱的极限强度隐藏在互动设计方程。所有三个设计方法需要独立进行检查，包括系数K计算。在下面，对荷载抗力系数设计法的特点进行了简要介绍。 结构系统内的内力及稳定性和它的构件是相关的，但目前美国钢结构协会（AISC）的荷载抗力系数规范把这种分开来处理的。在目前的实际应用中，结构体系和它构件的相互影响反映在有效长度这一因素上。这一点在社会科学研究技术备忘录第五录摘录中有描述。 尽管结构最大内力和构件最大内力是相互依存的（但不一定共存），应当承认，严格考虑这种相互依存关系，很多结构是不实际的。与此同时，众所周知当遇到复杂框架设计中试图在柱设计时自动弥补整个结构的不稳定（例如通过调整柱的有效长度）是很困难的。因此，社会科学研究委员会建议在实际设计中，这两方面应单独考虑单独构件的稳定性和结构的基础及结构整体稳定性。图28.1就是这种方法的间接分析和设计方法。 在目前的美国钢结构协会荷载抗力系数规范中，分析结构体系的方法是一阶弹性分析或二阶弹性分析。在使用一阶弹性分析时，考虑到二阶效果，一阶力矩都是由B1,B2系数放大。在规范中，所有细部都是从结构体系中独立出来，他们通过细部内力曲线和规范给出的那些隐含二阶效应，非弹性，残余应力和挠度的相互作用设计的。理论解答和实验性数据的拟合曲线得到了柱曲线和梁曲线，同时Kanchanalai发现的所谓“精确”塑性区解决方案的拟合曲线确定了梁柱相互作用方程。 为了证明单个细部内力对整个结构体系的影响，使用了有效长度系数，如图28.2所示。有效长度方法为框架结构提供了一个良好的设计。然而，有效长度方法的 外文出处： 《Exploiting Software How to Break Code》By Greg Hoglund, Gary McGraw Publisher : Addison Wesley Pub Date : February 17, 2004 ISBN : 0-201-78695-8 译文标题： JDBC接口技术 译文： JDBC是一种可用于执行SQL语句的JavaAPI（ApplicationProgrammingInterface应用程序设计接口）。它由一些Java语言编写的类和界面组成。JDBC为数据库应用开发人员、数据库前台工具开发人员提供了一种标准的应用程序设计接口，使开发人员可以用纯Java语言编写完整的数据库应用程序。 一、ODBC到JDBC的发展历程 说到JDBC，很容易让人联想到另一个十分熟悉的字眼“ODBC”。它们之间有没有联系呢？如果有，那么它们之间又是怎样的关系呢？ ODBC是OpenDatabaseConnectivity的英文简写。它是一种用来在相关或不相关的数据库管理系统（DBMS）中存取数据的，用C语言实现的，标准应用程序数据接口。通过ODBCAPI，应用程序可以存取保存在多种不同数据库管理系统（DBMS）中的数据，而不论每个DBMS使用了何种数据存储格式和编程接口。 1．ODBC的结构模型 ODBC的结构包括四个主要部分：应用程序接口、驱动器管理器、数据库驱动器和数据源。应用程序接口：屏蔽不同的ODBC数据库驱动器之间函数调用的差别，为用户提供统一的SQL编程接口。 驱动器管理器：为应用程序装载数据库驱动器。 数据库驱动器：实现ODBC的函数调用，提供对特定数据源的SQL请求。如果需要，数据库驱动器将修改应用程序的请求，使得请求符合相关的DBMS所支持的文法。 数据源：由用户想要存取的数据以及与它相关的操作系统、DBMS和用于访问DBMS的网络平台组成。 虽然ODBC驱动器管理器的主要目的是加载数据库驱动器，以便ODBC函数调用，但是数据库驱动器本身也执行ODBC函数调用，并与数据库相互配合。因此当应用系统发出调用与数据源进行连接时，数据库驱动器能管理通信协议。当建立起与数据源的连接时，数据库驱动器便能处理应用系统向DBMS发出的请求，对分析或发自数据源的设计进行必要的翻译，并将结果返回给应用系统。 2．JDBC的诞生 自从Java语言于1995年5月正式公布以来，Java风靡全球。出现大量的用java语言编写的程序，其中也包括数据库应用程序。由于没有一个Java语言的API，编程人员不得不在Java程序中加入C语言的ODBC函数调用。这就使很多Java的优秀特性无法充分发挥，比如平台无关性、面向对象特性等。随着越来越多的编程人员对Java语言的日益喜爱，越来越多的公司在Java程序开发上投入的精力日益增加，对java语言接口的访问数据库的API 的要求越来越强烈。也由于ODBC的有其不足之处，比如它并不容易使用，没有面向对象的特性等等，SUN公司决定开发一Java语言为接口的数据库应用程序开发接口。在JDK1．x 版本中，JDBC只是一个可选部件，到了JDK1．1公布时，SQL类包（也就是JDBCAPI） 毕业设计英文资料翻译 篇一：毕业设计(论文)外文资料与译文 大连东软信息学院高等教育自学考试毕业设计（论文）外文资料及译文 姓名： 准考证号： 专业： 助学单位： 大连东软信息学院 Dalian Neusoft University of Information张校辉020*********项目管理大连东软信息学院继续教育学院外文资料和译文格式要求 一、装订要求 1、外文资料原文（复印或打印）在前、译文在后、最后为指导教师评定成绩。 2、译文必须采用计算机输入、打印。 3、A4幅面打印，于左侧装订。 二、撰写要求 1、外文文献内容与所选课题相关。 2、译文汉字字数不少于3000字。 三、格式要求 1、译文字号：中文小四号宋体，英文小四号“Times New Roman”字型，全文统一，首行缩进2个中文字符，1.5倍行距。 2、译文页码：页码用阿拉伯数字连续编页，字体采用“Times New Roman”字体，字号小五，页底居中。 3、译文页眉：眉体使用单线，页眉说明五号宋体，居中“大连东软信息学院高等教育自学考试毕业设计（论文）译文”。 -1- -2- -3- 篇二：毕业设计外文资料翻译 毕业设计外文资料翻译 题目静压轴承密封件的水压特性水泵和电机学院专业机械工程及自动化 班级 学生王道国 学号指导教师王栋梁 二〇一三年六月五日 济南大学毕业设计外文资料翻译 静压轴承/密封件的水压特性水泵和电机。第1部分：理 论和实验 X 王 A山口 横滨国立大学工学部，日本横滨240-8501 XX年11月26日，在修订后的XX年2月25日收到XX 年3月7日接受 摘要 在这项研究中，磁盘型静压推力轴承的特性支承同心的负载，模拟的主要水液压泵和马达， 轴承/密封件。该轴承是由不锈钢，钢/不锈钢和不锈钢/塑料组成。通过研究作为载荷之间的关 系的特性进行评估容量，口袋压力，膜厚，泄漏流率。对于弹性材料的杨氏模量是一个非线性应 力作用在密封件上表面和压缩应变之间的关系。的承载能力所表示的比例流体静力平衡不是只依 XX Elsevier科学有限公司版权所有 关键词：静压推力轴承，喷嘴，不锈钢，热塑性弹性变形，承载能力，水液压泵和马达 1介绍 近年来，已经引起了水的液压系统主要的兴趣，因为他们的特点是用户友好和环 境安全。他们有很多优势，因为它们是无公害，无火灾造成风险，成本低，并提供高 南京理工大学 毕业设计(论文)外文资料翻译 教学点：南京信息职业技术学院 专业：电子信息工程 姓名：陈洁 学号： 014910253034 外文出处：《 Pci System Architecture 》 (用外文写) 附件： 1.外文资料翻译译文；2.外文原文。 指导教师评语： 该生外文翻译没有基本的语法错误，用词准确，没 有重要误译，忠实原文；译文通顺，条理清楚，数量与 质量上达到了本科水平。 签名： 年月日 注：请将该封面与附件装订成册。 附件1：外文资料翻译译文 64位PCI扩展 1.64位数据传送和64位寻址：独立的能力 PCI规范给出了允许64位总线主设备与64位目标实现64位数据传送的机理。在传送的开始，如果回应目标是一个64位或32位设备，64位总线设备会自动识别。如果它是64位设备，达到8个字节（一个4字）可以在每个数据段中传送。假定是一串0等待状态数据段。在33MHz总线速率上可以每秒264兆字节获取（8字节／传送＊33百万传送字／秒），在66MHz总线上可以528M字节／秒获取。如果回应目标是32位设备，总线主设备会自动识别并且在下部4位数据通道上（AD[31::00]）引导，所以数据指向或来自目标。 规范也定义了64位存储器寻址功能。此功能只用于寻址驻留在4GB地址边界以上的存储器目标。32位和64位总线主设备都可以实现64位寻址。此外，对64位寻址反映的存储器目标（驻留在4GB地址边界上）可以看作32位或64位目标来实现。 注意64位寻址和64位数据传送功能是两种特性，各自独立并且严格区分开来是非常重要的。一个设备可以支持一种、另一种、都支持或都不支持。 2.64位扩展信号 为了支持64位数据传送功能，PCI总线另有39个引脚。 ●REQ64#被64位总线主设备有效表明它想执行64位数据传送操作。REQ64#与FRAME#信号具有相同的时序和间隔。REQ64#信号必须由系统主板上的上拉电阻来支持。当32位总线主设备进行传送时，REQ64#不能又漂移。 ●ACK64#被目标有效以回应被主设备有效的REQ64#（如果目标支持64位数据传送），ACK64#与DEVSEL#具有相同的时序和间隔（但是直到REQ64#被主设备有效，ACK64#才可被有效）。像REQ64#一样，ACK64#信号线也必须由系统主板上的上拉电阻来支持。当32位设备是传送目标时，ACK64#不能漂移。 ●AD[64::32]包含上部4位地址／数据通道。 ●C/BE#[7::4]包含高4位命令/字节使能信号。 ●PAR64是为上部4个AD通道和上部4位C/BE信号线提供偶校验的奇偶校验位。 以下是几小结详细讨论64位数据传送和寻址功能。 3.在32位插入式连接器上的64位卡 理工学院毕业设计(论文)外文资料翻译 专业：热能与动力工程 姓名：赵海潮 学号：09L0504133 外文出处：Applied Acoustics, 2010(71):701~707 附件： 1.外文资料翻译译文；2.外文原文。 附件1：外文资料翻译译文 基于一维CFD模型下汽车排气消声器的实验研究与预测Takeshi Yasuda, Chaoqun Wua, Noritoshi Nakagawa, Kazuteru Nagamura 摘要目前，利用实验和数值分析法对商用汽车消声器在宽开口喉部加速状态下的排气噪声进行了研究。在加热工况下发动机转速从1000转/分钟加速到6000转/分钟需要30秒。假定其排气消声器的瞬时声学特性符合一维计算流体力学模型。为了验证模拟仿真的结果，我们在符合日本工业标准（JIS D 1616）的消声室内测量了排气消声器的瞬态声学特性，结果发现在二阶发动机转速频率下仿真结果和实验结果非常吻合。但在发动机高阶转速下（从5000到6000转每分钟的四阶转速，从4200到6000转每分钟的六阶转速这样的高转速范围内），计算结果和实验结果出现了较大差异。根据结果分析，差异的产生是由于在模拟仿真中忽略了流动噪声的影响。为了满足市场需求，研究者在一维计算流体力学模型的基础上提出了一个具有可靠准确度的简化模型，相对标准化模型而言该模型能节省超过90％的执行时间。 关键字消声器排气噪声优化设计瞬态声学性能 1 引言 汽车排气消声器广泛用于减小汽车发动机及汽车其他主要部位产生的噪声。一般而言，消声器的设计应该满足以下两个条件：（1）能够衰减高频噪声，这是消声器的最基本要求。排气消声器应该有特定的消声频率范围，尤其是低频率范围，因为我们都知道大部分的噪声被限制在发动机的转动频率和它的前几阶范围内。（2）最小背压，背压代表施加在发动机排气消声器上额外的静压力。最小背压应该保持在最低限度内，因为大的背压会降低容积效率和提高耗油量。对消声器而言，这两个重要的设计要求往往是互相冲突的。对于给定的消声器，利用实验的方法，根据距离尾管500毫米且与尾管轴向成45°处声压等级相近的排气噪声来评估其噪声衰减性能，利用压力传感器可以很容易地检测背压。 近几十年来，在预测排气噪声方面广泛应用的方法有：传递矩阵法、有限元法、边界元法和计算流体力学法。其中最常用的方法是传递矩阵法（也叫四端网络法）。该方 附件1：外文资料翻译译文 包装对食品发展的影响 一个消费者对某个产品的第一印象来说包装是至关重要的，包括沟通的可取性，可接受性，健康饮食形象等。食品能够提供广泛的产品和包装组合，传达自己加工的形象感知给消费者，例如新鲜包装/准备，冷藏，冷冻，超高温无菌，消毒（灭菌），烘干产品。 食物的最重要的质量属性之一，是它的味道，其影响人类的感官知觉，即味觉和嗅觉。味道可以很大程度作退化的处理和/或扩展存储。其他质量属性，也可能受到影响，包括颜色，质地和营养成分。食品质量不仅取决于原材料，添加剂，加工和包装的方法，而且其预期的货架寿命（保质期）过程中遇到的分布和储存条件的质量。越来越多的竞争当中，食品生产商，零售商和供应商；和质量审核供应商有显着提高食品质量以及急剧增加包装食品的选择。这些改进也得益于严格的冷藏链中的温度控制和越来越挑剔的消费者。 保质期的一个定义是：在食品加工和包装组合下，在食品的容器和条件，在销售点分布在特定系统的时间能保持令人满意的食味品质。保质期，可以用来作为一个新鲜的概念，促进营销的工具。延期或保质期长的产品，还提供产品的使用时间，方便以及减少浪费食物的风险，消费者和/或零售商。包装产品的质量和保质期的主题是在第3章中详细讨论。 包装为消费者提供有关产品的重要信息，在许多情况下，使用的包装和/或产品，包括事实信息如重量，体积，配料，制造商的细节，营养价值，烹饪和开放的指示，除了法律准则的最小尺寸的文字和数字，有定义的各类产品。消费者寻求更详细的产品信息，同时，许多标签已经成为多语种。标签的可读性是为视障人士的问题，这很可能成为一个对越来越多的老年人口越来越重要的问题。 食物的选择和包装创新的一个主要驱动力是为了方便消费者的需求。这里有许多方便的现代包装所提供的属性，这些措施包括易于接入和开放，处置和处理，产品的知名度，再密封性能，微波加热性，延长保质期等。在英国和其他发达经济体显示出生率下降和快速增长的一个相对富裕的老人人口趋势，伴随着更加苛 Highway Subgrade Construction in Expansive Soil Areas Jian-Long Zheng1 Rui Zhang2 and He-Ping Yang3 1 Professor and President, ChangSha Univ. of Science and Technology, Chiling Road 45, Changsha, Hunan 410076, China. E-mail: zjl_csust@https://www.doczj.com/doc/8f9214790.html, 2 Ph.D. Candidate and Lecturer, School of Highway Engineering, ChangSha Univ. of Science and Technology, Chiling Road 45, Changsha, Hunan 410076, China. E-mail: zr_csust@https://www.doczj.com/doc/8f9214790.html, 3Professor, School of Highway Engineering, ChangSha Univ. of Science and Technology, Chiling Road 45, Changsha, Hunan 410076, China. E-mail: cscuyang@https://www.doczj.com/doc/8f9214790.html, (Accepted 22 May 2007) Introduction Expansive soil is predominantly clay soil that undergoes appreciable volume and strength changes following a change in moisture content. These volume changes can cause extensive damage to the geotechnical infrastructure, and the damage is often repeatable and latent in the long term (Liao 19848). China is one of the countries with a wide distribution of expansive soils. They are found in more than 20 provinces and regions, nearly 600,000?km2in extent. It has been estimated that the planned highways totaling 3,300?km in length pass through expansive soils areas (Zheng and Yang 200422). Improper highway construction in such areas could well lead to great losses and damage to the environment. In 2002, the Chinese Ministry of Communications (CMOC) sponsored a research project, “A Complete Package for Highway Construction in Expansive Soil Areas,” whose primary objective was to solve expansive soil problems in highway engineering. A research group with personnel from Changsha University of Science and Technology (CUST) was set up. Comprehensive laboratory tests, field investigations, and analyses were carried out, aimed at solving highway engineering problems in several different expansive soil areas. A complete presentation of the results of this research is beyond the scope of this paper, but the research on subgrade 英文原文 Components of A Building and Tall Buildings Andre 1. Abstract Materials and structural forms are combined to make up the various parts of a building, including the load-carrying frame, skin, floors, and partitions. The building also has mechanical and electrical systems, such as elevators, heating and cooling systems, and lighting systems. The superstructure is that part of a building above ground, and the substructure and foundation is that part of a building below ground. The skyscraper owes its existence to two developments of the 19th century: steel skeleton construction and the passenger elevator. Steel as a construction material dates from the introduction of the Bessemer converter in 1885.Gustave Eiffel (1832-1932) introduced steel construction in France. His designs for the Galerie des Machines and the Tower for the Paris Exposition of 1889 expressed the lightness of the steel framework. The Eiffel Tower, 984 feet (300 meters) high, was the tallest structure built by man and was not surpassed until 40 years later by a series of American skyscrapers. Elisha Otis installed the first elevator in a department store in New York in 1857.In 1889, Eiffel installed the first elevators on a grand scale in the Eiffel Tower, whose hydraulic elevators could transport 2,350 passengers to the summit every hour. 2. Load-Carrying Frame Until the late 19th century, the exterior walls of a building were used as bearing walls to support the floors. This construction is essentially a post and lintel type, and it is still used in frame construction for houses. Bearing-wall construction limited the height of building because of the enormous wall thickness required；for instance, the 16-story Monadnock Building built in the 1880’s in Chicago had walls 5 feet (1.5 meters) thick at the lower floors. In 1883, William Le Baron Jenney (1832-1907) supported floors on cast-iron columns to form a cage-like construction. Skeleton construction, consisting of steel beams and columns, was first used in 1889. As a consequence of skeleton construction, the enclosing walls become a “curtain wall” rather than serving a supporting function. Masonry was the curtain wall material until the 1930’s, when light metal and glass curtain walls were used. After the introduction of Center Lathe 4.1 INTRODUCTION Lathe is the oldest machine tool invented, starting with the Egyptian tree lathes. In the Egyptian tree lathe, one end of the rope wound round the workpiece is attached to a flexible branch of a tree while the other end is pulled by the operator, thus giving the rotary motion to the workpiece. This primitive device has evolved over the last two centuries to be one of the most fundamental and versatile machine tools with a large number of uses in all manufacturing shops. The principal form of surface produced in a lathe is the cylindrical surface. This is achieved by rotating the workpiece while the single point cutting tool removes the material by traversing in a direction parallel to the axis of rotation and termed as turning as shown in Fig.4.1.The popularity of the lathe due to the fact that a large variety of surfaces can be produced. Different types of lathes are used in manufacturing shops. Some of them are: (a)Centre lathe (b)Tool room lathes (c)Special purpose lathes (d)Copying lathe (e)Gap bed lathe (f)Capstan and turret lathes (g)Automatic lathes The centre lathe is the most common lathe which derives its name from the way a workpiece is clamped by centres in a lathe, though this is not the only way in which the job is mounted. This is sometimes also called as engine lathe in view of the fact that early lathes were driven by steam engines. This is generally used for more general applications and thus the construction of the machine tool is more rigid. The tool room lathe is generally meant for applications of tool making, where the accuracy desired is much higher than that is normally required for general production 编号： 毕业设计(论文)外文翻译 （原文） 院（系）：应用科技学院 专业：机械设计制造及其自动化 学生姓名：邓瑜 学号：0501120501 指导教师单位：应用科技学院 姓名：黄小能 职称： 2009年 5 月20 日 The Injection Molding The Introduction of Molds The mold is at the core of a plastic manufacturing process because its cavity gives a part its shape. This makes the mold at least as critical-and many cases more so-for the quality of the end product as, for example, the plasticiting unit or other components of the processing equipment. Mold Material Depending on the processing parameters for the various processing methods as well as the length of the production run, the number of finished products to be produced, molds for plastics processing must satisfy a great variety of requirements. It is therefore not surprising that molds can be made from a very broad spectrum of materials, including-from a technical standpoint-such exotic materials as paper matched and plaster. However, because most processes require high pressures, often combined with high temperatures, metals still represent by far the most important material group, with steel being the predominant metal. It is interesting in this regard that, in many cases, the selection of the mold material is not only a question of material properties and an optimum price-to-performance ratio but also that the methods used to produce the mold, and thus the entire design, can be influenced. A typical example can be seen in the choice between cast metal molds, with their very different cooling systems, compared to machined molds. In addition, the production technique can also have an effect; for instance, it is often reported that, for the sake of simplicity, a prototype mold is frequently machined from solid stock with the aid of the latest technology such as computer-aided (CAD) and computer-integrated manufacturing (CIM). In contrast to the previously used methods based on the use of patterns, the use of CAD and CAM often represents the more economical solution today, not only because this production capability is available pin-house but also because with any other technique an order would have to be placed with an outside supplier. Overall, although high-grade materials are often used, as a rule standard materials are used in mold making. New, state-of-the art (high-performance) materials, such as ceramics, for instance, are almost completely absent. This may be related to the fact that their desirable characteristics, such as constant properties up to very high temperatures, are not required on molds, whereas their negative characteristics, e. g. low tensile strength and poor thermal conductivity, have a clearly related to ceramics, such as sintered material, is found in mild making only to a limited degree. This refers less to the modern materials and components软件开发概念和设计方法大学毕业论文外文文献翻译及原文
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