Ultra-Low Capacitance TVS
for ESD and CDE Protection
PROTECTION PRODUCTS - RailClamp ?Description
Features
Dimensions
Schematic & PIN Configuration
RailClamps are ultra low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically designed to protect sensi-tive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients).
The RClamp TM 1502B has a typical capacitance of only 0.60pF (pin 1 to 2). This means it can be used on circuits operating in excess of 3GHz without signal attenuation. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4(±15kV air, ±8kV contact discharge). Each device can be configured to protect 1 bidirectional line or two unidirectional lines.
These devices are in a small SC-75 (SOT-523) package and feature a lead-free, matte tin finish. They are com-patible with both lead free and SnPb assembly tech-niques. They are designed for use in applications where board space is at a premium. The combination of small size, low capacitance, and high level of ESD protection makes them a flexible solution for applications such as Automatic Test Equipment and Infiniband circuits.
Applications
Mechanical Characteristics
Automatic Test Equipment Firewire Ports
GaAs Photodetector Protection HBT Power Amp Protection
Infiniband Transceiver Protection
Transient protection for high-speed data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)IEC 61000-4-4 (EFT) 40A (5/50ns) Designed to replace polymer TVS Protects up to two I/O lines Ultra-Low capacitance (<1pF)
No insertion loss to >3.0GHz
>3.0GHz Low profile (<1mm)
Low leakage current and clamping voltage Low operating voltage: 15.0V
Solid-state silicon-avalanche technology
SC-75 (SOT-523) package Lead Finish: Matte Tin RoHS/WEEE Compliant
Molding compound flammability rating: UL 94V-0 Marking: P6
Packaging: Tape and Reel
Absolute Maximum Rating
Electrical Characteristics (T=25o C)
r
e t e m a r a P l o b m y S s
n o i t i d n o C m u m i n i M l a c i p y T m
u m i x a M s t i n U e g a t l o V f f O -d n a t S e s r e v e R V M W R 3n i P o t 2n i P r o 1n i P 2d n a 1s n i P n e e w t e B d n a 5
1V e
g a t l o V n w o d k a e r B e s r e v e R V R
B I t A
m 1=3n i P o t 2n i P r o 1n i P 2d n a 1s n i P n e e w t e B d n a 7
.61V
t
n e r r u C e g a k a e L e s r e v e R I R
V M W R C °52=T ,V 51=3n i P o t 2n i P r o 1n i P 2d n a 1s n i P n e e w t e B d n a 1A
μe g a t l o V g n i p m a l C V C I P P s
μ02/8=p t ,A 1=2n i P o t 1n i P 23V e g a t l o V g n i p m a l C V C I P P s μ02/8=p t ,A 5=3n i P o t 2n i P r o 1n i P 63V e
g a t l o V g n i p m a l C V C
I P P s
μ02/8=p t ,A 5=2n i P o t 1n i P 0
4V e c n a t i c a p a C n o i t c n u J C j V R z H M 1=f ,V 0=2n i P o t 1n i P 0
6.09.0F p e
c n a t i c a p a C n o i t c n u J C j
V R z H M 1=f ,V 0=3
n i P o t 2n i P r o 1n i P 5
.1F
p g
n i t a R l o b m y S e u l a V s t i n U )s μ02/8=p t (r e w o P e s l u P k a e P P k p 002s t t a W )s μ02/8=p t (t n e r r u C e s l u P k a e P I P P 5A )
r i A (2-4-00016C E I r e p D S E )t c a t n o C (2-4-00016C E I r e p D S E V D S E 518V k e r u t a r e p m e T g n i t a r e p O T J 521+o t 55-C °e
r u t a r e p m e T e g a r o t S T G
T S 0
51+o t 55-C
°
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
010
20304050607080901001100
25
50
75
100
125150
Ambient Temperature - T A (o
C)
% o f R a t e d P o w e r o r I P P
Clamping Voltage vs. Peak Pulse Current
Pin 1 to Pin 2
Clamping Voltage vs. Peak Pulse Current
Pin 1 or Pin 2 to Pin 3
Junction Capacitance vs. Reverse Voltage
Pin 1 to Pin 2
24
2628303234
360
1
2
3
4
5
6
Peak Pulse Current - I PP (A)
C l a m p i n g V o l t a g e - V C
(V )
24
26283032343638400
1
2
3
4
5
6
Peak Pulse Current - I PP (A)
C l a m p i n g V o l t a g e - V C
(V )
0.01
0.1
1
100.1
1
10
100
1000
Pulse Duration - tp (μs)
P e a k P u l s e P o w e r - P P k (k W )
0.20.40.60.811.20
51015
Reverse Voltage - V R (V)
N o r m a l i z e d C a p a c i t a n c e - C j (p F )
Normalized Capacitance vs. Reverse Voltage
Pin 1 or Pin 2 to Pin 3
0.5
1
1.50
2
4
681012
14
Reverse Voltage - V R (V)
N o r m a l i z e d C a p a c i t a n c e - C j (p F )
Insertion Loss S21 (Pin 1 to Pin 2)
ESD Response (4kV Contact per IEC 61000-4-2)Typical Characteristics
ESD Response (8kV Contact per IEC 61000-4-2)
1
2
3
START
. 030 MHz 3 STOP 000 . 000 000 MHz
CH1 S21 LOG
6 dB / REF 0 dB
1: .00460 dB 900 MHz
2: .02010 dB 1.8 GHz
3: -.08180 dB 2.5 GHz
0 dB -6 dB -12 dB -18 dB -24 dB -30 dB
-36 dB
1
GHz 100 MHz 3 GHz 10
MHz 1
MHz
Insertion Loss S21 (Pin 1 or Pin 2 to Pin 3)
1
2
3
START
. 030 MHz 3 STOP 000 .000 000 MHz
CH1 S21 LOG
6 dB / REF 0 dB
1: .03430 dB 900 MHz
2: .07870 dB 1.8 GHz
3: .28040 dB 2.5 GHz
0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB
1
GHz 100 MHz
3 GHz 10
MHz
1 MHz
Analog Crosstalk
3 .CH1
S21 LOG
20 dB / REF 0 dB
Device Connection Options
This device is optimized for protection of 1 line
operating in excess of 3GHz. It may also be used to protect two lines, but it is recommended it not be used much beyond 1GHz due to cross talk limitations. The device is connected as follows:
One data line can be connected to either pin 1 or pin 2with the other connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected.Protection of two lines is achieved by connecting data lines at pins 1 & 2. Pin 3 is connected to ground. The connection to ground should be made directly to a ground plane. The path length should also be kept as short as possible to minimize parasitic inductance.Matte Tin Lead Finish
Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains.Since the solder volume on the leads is small com-pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste.Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition,unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.
Figure 1. Pin Configuration
Applications Information
Applications Information - Spice Model
s r e t e m a r a P e c i p S B 2051p m a l C R -1e l b a T r
e t e m a r a P t i n U )S V T (1D )S V T (2D S I p m A 41-E 32.141-E 32.1V B t l o V 8.128.12J V t l o V 27.027.0S R m h O 108.2108.2V B I p m A 3-E 0.13-E 0.1O J C d a r a F 21-E 3.121-E 3.1T T c e s 9-E 145.29-E 145.2M --330.0330.0N --1.11.1G
E V
e 1
1.11
1.1
Outline Drawing -SC-75 (SOT-523)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012Phone: (805)498-2111 FAX (805)498-3804
r e b m u N t r a P r e p y t Q l e e R l e e R e z i S T
C T .B 2051p m a l C R 0
00,3h
c n I 7Ordering Information
Tape and Reel Specification
RailClamp and RClamp are registered marks of Semtech Corporation
Marking
Device Orientation in Tape
e p a T h
t d i W )x a M (,B D 1D )
N I M (E F
K )
X A M (P 0P 2P )X A M (T W
m
m 8m m 2.4)561.(m m 1.0+5.1m m 0.0-500.+95.0()
000.-m m 0.1)
930.(01.±
057
.1m m )
400.±960.(50.0±5.3m m )
200.±831.(m m 4.2)
490.(1.0±0.4m m -00.±751.()
41.0±0.4m m -00.±751.()
4-m 50.0±0.2m )
200.±970.(m m 4.0)610.(m m 3.8)
210.±213.(P6
0A 0B 0K m
m 50.0±58.1m
m 50.0±58.1m
m 50.0±88.0