Description Remark #3T
Train-The-Trainer 4M
Man, Material, Machine, Method, SEIRI – sort out items and discard the unnecessary SEITON – arrange – a place for everything Everything in its place
SEISO – clear your workplace thoroughly SEIKETSU – maintain a standard
SHITSUKE – train people to be disciplined 8D Eight Disciplines (eight-diagrams)
A AC Alternating Current
ACPI Advanced Configuration and Power Interface AGP Accelerated Graphic Port
AOI Automatic Optical Inspection
API Application Programming Interface APM Advanced Power Management
ARCD Applications Restore Compact Disc ARRF Announce Return Rate Factor
ASAU Automatic Side Access Units
ASIC Application Specific Integrated Circuit ASQC American Society for Quality Control AT After Test
ATE Automatic Test Equipment
ATM Asynchronous Transfer Mode
AVL Authorized Vendor List
B BGA Ball Grid Array
BI Burn-In test
BIOS Basic Input/Output System
BOM Bill Of Materials
BOL Bill of lending
BPS Bit Per Second
BTO Build To Order
C CA
D Computer-Aided Design
CAI Computer-Aided Issue System
CBT Computer Base Training
CCP Channel Configuration Program
CD Compact Drive
CD-ROM Compact Disc Read Only Memory C&F Cost & Freight
CF Code Freeze
CIF Cost Insurance Freight
CIM Computer-Integrated Manufacturing CKD Complete Knock Down
CKK Compaq K K
CLCA
Close Loop Current Action 5S
(Housekeeping
for continued
improvement)Abbreviation
CMOS Complementary Metal Oxide Semiconductor
CND Can Not Duplicate
COMM Communication (Group)
COMS Commercial
CONS When making trade-offs, list out the Negative (Con) items
COO Country Of Origin
CPA
CPU Complete Product Unit (Final Assembly), Central Processing Unit CRC Cyclic Redundancy Check
CRM Customer Return Material
CRP Conference Room Polite
CRT Cathode-Ray Tube
CRU
CST Central Standard Time
CTO Configure To Order
D DAC Direct Alliance Company (CTO), Digital/Analog Converter
DB Design Build
DBP Dealer Buy Price
DC Direct Current
DCE(Compaq) Distribution Center Europe
DEV Development
DFM Design For Manufacturing
DFP Drive Failure Prediction
DFX Design For “X” (where X= Manufacturability, Serviceability or
Featureability)
DMA Direct Memory Access
DNUB Demand Net Units Built
DNUB Desire Net Unit Build
DOA Dead on Arrival
DOMAIN Distributed Operating Multi-Access Interactive Network
DRAM Dynamic Random Access Memory
DRRF Demonstrated Return Rate Factor
DRRF Defect Return Rate Factor
DSP Digital Signal Processing
DSTN Dual Super Twisted Nematic, Double-layer Supertwist Nematic
(Liquid Crystal Display)
DVD Digital Video Drive
DVT Design Validation Test
E EAPR Early Awareness Group, also known as Level-3
ECN Engineering Change Notice
ECO Engineering Change Order
ECR Engineering Change Request
EDI Electronic Data Interchange
EDO Extended Data Output (Dynamic Random Access Memory)
EE Electrical Engineering
EEPROM Electrically Erasable Programmable Read-Only Memory
EHS&S Environmental Health Security & Safety
EIDE Enhanced Intelligent Drive Electronics or Integrated Drive Electronics EMC Electromagnetic Compatibility
EMEA Europe, Mid-East, Africa
EMI Electromagnetic Interference
EOB End Of Business
EOCT Enhance Outgoing Compatibility Test
EOL End Of Life
EORT Enhance Ongoing Reliability Test
EOS Electrical Over Stress
EPIA Enhance Product Integration Audit
EPP Enhance Parallel Port
EPROM Erasable Programmable Read-Only Memory
ERP Engineering Problem Resolution, Enterprise Resource Planning EURPs End User Replaceable Parts
ES Engineering Sample
ESCD Extended System Configuration Data
ESD Electrical Static Discharge
EST Eastern Standard Time
ETA Estimate Time of Arrival
ETD Estimate Time of Delivery
F FA Final Assembly
FAB Fabrication
FAD Functional As Design
FAE Field Application Engineering
FAI First Article Inspection
FB First Build
FCC Federal Communications Commission
FD Factory Drop
FDD Floppy Disc Drive
FDDI Fiber Distributed Data Interface
FDI Flash Data Integrator
FEA
FFC Flexible Flat Cable
FFR Field Fill Rate
FIS Factory Information System
FLT Fixed Lead Time
FOB Free On Board
FPC Flexible Printed Circuit
FPF First Pass Fall-out
FRR Field Return Rate
FRU Field Replacement Unit
FS First Ship
FSTN Faster Dual Super Twisted Nematic, Faster Double-layer Supertwist Nematic (Liquid Crystal Display)
FTP File Transfer Protocol
FVT Function Validation Test
FW Firmware
FYI For Your Information
G GDS Globe Distribution Service
GEM/NAFTA Government Educational Market / North America Free Trade Act GM Golden Master
GUI Graphical User Interfaces
H HALT
HASA
HCT Hardware Compatibility Test, Microsoft
HDD Hard Disk Drive
HDI HDD Decompression Inspection
HOU Houston
HW Hardware
I IBA Intelligent Battery Architecture
IC Image Complete
IC Integrated Circuit
ICT In Circuit Test
IDE Intelligent Drive Electronics or Integrated Drive Electronics
IFR Initial Field Rate (defective accumulation / shipment accumulation) III Institute For Information Industry
INUB Increasing Net Unit Build
IOD International Operations Department
IPI Initial Production Inspection
IQC Incoming Quality Control
IR Infrared
IRQ Interrupt Request
IRRF Initial Return Rate Factor
ISA Industry Standard Architecture
ISDN Integrated Services Digital Network
ISO International Standards Organization
ISP Internet Service Provider
IUR Internal Unit Requisition
J JIT Just In Time
K KMAT Kit Match = All possible modules (ZMODs)
L LAN Local Area Network
L/C Letter of Credit
LCD Liquid Crystal Display
LCM Liquid Crystal Module
LCVP Life Cycle Volume Plan
LED Light Emitting Diode
Li-Ion Lithium-Ion
LOA Letter of Authorization
LOH Labor Over-Head
LSI Large Scale Integrated Circuit
LVDS Low Voltage Differential Signal
M MAD Major Account Distribution
MAR Marlboro
ME Mechanical Engineering
MFG Manufacturing
MIDI Musical Instrument Digital Interface
MIS Management Information System
MKT Marketing
MLOB Material, Labor and Overhead Burden
MN Manufacturing Notice
MO Manufacturing Order
MODEM Modulator-Demodulator
MOS Metal Oxide semiconductor
MPEG Moving Picture Experts Group
MRD Marketing Requirement Document
MRP Manufacturing Resources Planning, Material Require Plan
MSP Material Supply Plan
MTBF Mean Time Between Failure
MTD Manufacturing Technology Department
MVB Manufacturing Validation Build, Manufacturing Verification Build MVS Manufacturing Verification System
NAFTA North America Free Trade Agreement
N NAV Norton Anti-Virus (Software)
NIC Network Interface Circuitry
NiMH Nickel-Metal Hydride
NRE Non-Recurring Engineering Cost
NUB Net Units Billed
O OCT Order Cycle Time(from SO receive till actual ship), Out-of Cycle Time ODM Original Design Manufacture
OEM Original Equipment Manufacture
OQC Outgoing Quality Control
ORT Ongoing Reliability Test
OS Operation System
P PA Package Assembly
PCA Print Circuit-Board Assembly (Subassembly)
PCB Printed Circuit Board
PCI Peripheral Component Interconnect
PCMCIA Personal Computer Memory Card Interface Association
PCN Production Change Notice
PDD Product Development Definition (Project Proposal)
PDP Product Development & Promote, Process Develop Plan
PDPM Product Development & Promote Management
PET
PGA Pin Grid Array
PI Pilot Inspection
PIA Product Integration Audit
PIA Product Integrity Audit
PMP Process Management Plan
PMR Package Manufacturing Release, Post Mortem Review PnP Plug and Play
PO Purchase Order, Program Office, President Office
POD Print On Demand (label)
POR Plan Of Record
PPM Part Per Million
PPR
PPU Pre-Production Unit
PQC Process Quality Control
PR Public Relations (Press, Magazines, Marketing)
PROM Programmable Read-Only Memory
PROS When making trade-offs, list out the Positive (Pro) items PRR Production Readiness Review
PT Pre Test
PTT
PTX Process Custom Tax
PV Product Validation
PVE Process Value Engineering
PVR PV Regression
PVS Packing Verification System
PVT Product Validation Test
P&L
Q QA Quality Assurance
QA Quality Assurance
QBR Quarterly Business Review
QC Quality Control
QIT Quality Improvement Team
QP Qualify Pass
QRCD Quick Restore Compact Disc
QS Qualification Sample
QSR Quarterly Service Review-Meeting
QVL Qualified Vendor List
QVR Quarterly Vendor Review
R RAM Random Access Memory
RD Research & Development
RDT Reliability Demonstrated Test
RDT Reliability Demonstrator Test
RF Radiation Frequency
RFQ Request For Quotation
RI Run-In test
RISC Reduce Instruction Set Computing
RMA Return Material Authorization
ROI
ROM Read Only Memory
ROW Rest Of World
RRF Return Rate Factor
RSC Regular Slotted Container
RSP Require Supplier Plan
RTD Real time Decision
RTM Release To Manufacturing
RTV Return To Vendor
S SA Sub Assembly
SAP System Applications And Products In Data Processing
SBE Small Business Edition Software from Microsoft
SCSI Small Computer System Interface
SDRAM Synchronous DRAM
SE System Engineering
SGRAM Synchronous Graphic Random Access Memory
SHM Shop-flow management
SI System Integration
SIB System Integration Build
SIMM Single-In-Line Memory Module
SIR SI Regression
SIT System Integration Test
SKD Semi Knock Down
SLA
SMART Self Monitoring Analysis & Reporting Technology
SMB Small and Medium Business
SMD Surface Mount Device
SMT Surface Mount Technique
SNUB Supply Net Units Built
SO Sales Order
SOP Shortage Order Purchase-Balance
SPC Statistics Process Control
SPI Synchronous Peripheral Interface
SPS Spare Part Service
SRAM Static Random Access Memory
SRCD System Restore Compact Disc
SRP Suggested Retail Price
SRP SKUs Re-Engineering Process
STFC Ship To First Commit (actual ship versus first commit build plan) SVGA Super Video Graphics Array (800 by 600 pixels)
SW Software
SXGA Super Ultra Video Graphics Array (1280 by 1024 pixels)
T T&Cs Terms & Conditions (incentives/promotional agreement) TBD To Be Determined
TCP/IP Transmission Control Protocol/Internet Protocol
TFT Thin Film Transistor
TOC Theory Of Constraints
TOPS Total Order Planning System
TPM Total Productive Maintenance
TRN Technical Reference Note
TSR Terminate and Stay Resident
TTL Transistor-Transistor Logic
TTM Time To Market
TTV Time To Volume
TVR Tooling Verification Report
TWI Training Within Industry
U UART Universal Asynchronous Receiver/Transmitter UDMA Ultra Direct Memory Access
UET User Environment Test
URL Uniform Resource Locator
USB Universal Serial Bus
UUT Unit Under Test
V VARs
VCN Version Control Notice
VGA Video Graphics Array (640 by 480 pixels)
VLSI Very Large Scale Integrated Circuits
W WAT Wide Area test
WHQL Windows Hardware Qualification Lab
WIP Work In Process
WNF Will Not Fixed
WRRF Working Return Rate Factor
WUS Whole Unit Service
X XGA(Ultra Video) Extended Graphics Array (1024 by 768 pixels) Z ZIF Zero Insertion Force
ZMOD Zero Module
ZV Zoomed Video (Port)